3DiS Technologies offers 3D integration and 3D packaging solutions based on its innovative 3D interconnection technologies. By leveraging the third dimension, the company’s cutting-edge technologies enable miniaturization of electronic systems and passive devices while improving their performance.
We use cutting edge 3D integration technologies to enable our customers to imagine, design and produce small form factor 3D electronic systems and products that matter.
We help our customers to improve the performance of their products by reducing interconnect length through direct 3D integration and to increase integration density through Wafer-Level 3D Packaging.
We add more value to our customer’s products through Wafer-Level 3D system integration and simultaneous integration of high-performance, small form factor, 3D integrated passive devices.