Our technology portfolio, based on peripheral 3D interconnect process, allow wafer-level 3D system packaging and integration of 3D passive devices. We continuously develop these technologies in order for us to offer best in class solutions to our customers.
Since our company is committed to providing creative and innovative solutions to our customers, we offer the possibility to develop custom technology variants that are based on our 3D interconnect process. Examples of  custom developments for applications such as: