3DiS Technologies offer design, simulation and measurement services for advanced 3D packaging, RF components & systems and Integrated Passive Devices. These services can be part of products and services that are based on our 3D integration technologies, or, as outsourced ones to help our customers accelerating the development of their products.
Services for system integration and packaging at wafer level (WL-SiP) cover the entire product development phase, from feasibility study, design and prototyping to production. Our company strives to offer the best solution that meets our clients demands and requirements. Whenever possible, these solutions will be based on our 3D interconnection technologies. Our services include, but not limited to :
3DiS Technologies offers custom design & fabrication services for 3D Integrated Passive Devices (3D IPD). These devices, based on customer’s requirements, will exhibit improved performance and reduced footprint compared to thin film IPD. Our services include, but not limited to :