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News & Upcoming Events


Electronic Components and Technology Conference (ECTC) 2018

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3DiS Technologies will be presenting “Ultra-Compact, High-Performance, 3D-IPD Integrated using Conformal 3D Interconnects” paper at The Electronic Components and Technology Conference (ECTC) 2018. Kindly attend to our CEO’s Ayad GHANNAM presentation the 31st of May at 3:55 pm in Session 23: RF and THz Module Components.   The Electronic Components and Technology Conference (ECTC) is […]

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3DiS is nominated for “Start-up of the Year” award by 3D InCites

· · | Uncategorized

2017 3D InCites Awards Vote   3DiS Technologies is nominated for 3D InCites “Start-up of the Year” award. You are welcomed to connect to https://www.3dincites.com/3d-incites-awards/2017-3d-incites-awards-vote/  and vote for our start-up. You may vote one time in a 24 hour period.   The 3D InCites Awards were established in 2013 to acknowledge companies who were instrumental in bringing […]

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System-in-Package (SiP) Conference 2017

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3DiS Technologies will be presenting “Wafer-level 3D system packaging of IoT devices enabled by conformal 3D Interconnects” during startup pitch session. Kindly attend our presentation the 27th of June at 4:30 pm.   SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs – market trends, system integration/miniaturization, […]

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SEMICON Europa 2016 – A success!

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3DiS Technologies team would like to thank all of you who visited our stand at Semicon Europa 2016 ! Thanks to you, our exhibition was a big success! We are looking forward to do a very successful business with you.   We also would like thank SEMI for giving us the opportunity to exhibit at […]

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