3DiS Technologies presented at SEMI’s 3D & System Summit in Dresden (2020)
Ayad GHANNAM, 3DiS Technologies CEO presented “3D-RDL and Conformal High Aspect Ratio Pre-formed TPVs for RDL-First Type FO-Packages: Enabler of Advanced 3D Wafer-level System Packaging for 5G Applications” at SEMI’s 3D & System Summit. Nowadays, RF communication modules are integrated in an increasing number of electronic devices. With the tight requirements of 5G applications, these […]