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News & Upcoming Events


3DiS Technologies : winner of 3DInCites “Process of the Year” Award

· · · · · · · | News · Uncategorized

3DiS Technologies Dielectric-core-based HAR Thru-Package-Vias forming using 3D-RDL won the 3DInCites “Process of the Year” Award. The competition in this category was with Xperi, Plan Optik, CEA-Leti and YES. It is great to see 3DiS Technologies recognized for one of its innovative, 3D-RDL-based, advanced 3D Wafer-Level-Packaging technology solution. This technology enables innovation in advanced 3D […]

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3DiS Technologies presented at SEMI’s 3D & System Summit in Dresden (2020)

· · · · · · · · | Events

Ayad GHANNAM, 3DiS Technologies CEO presented “3D-RDL and Conformal High Aspect Ratio Pre-formed TPVs for RDL-First Type FO-Packages: Enabler of Advanced 3D Wafer-level System Packaging for 5G Applications” at SEMI’s 3D & System Summit. Nowadays, RF communication modules are integrated in an increasing number of electronic devices. With the tight requirements of 5G applications, these […]

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