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News & Upcoming Events

01
Feb

3DiS Technologies presented at SEMI’s 3D & System Summit in Dresden (2020)

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Ayad GHANNAM, 3DiS Technologies CEO presented “3D-RDL and Conformal High Aspect Ratio Pre-formed TPVs for RDL-First Type FO-Packages: Enabler of Advanced 3D Wafer-level System Packaging for 5G Applications” at SEMI’s 3D & System Summit. Nowadays, RF communication modules are integrated in an increasing number of electronic devices. With the tight requirements of 5G applications, these […]

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02
Nov

SEMICON Europa 2016 – A success!

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3DiS Technologies team would like to thank all of you who visited our stand at Semicon Europa 2016 ! Thanks to you, our exhibition was a big success! We are looking forward to do a very successful business with you.   We also would like thank SEMI for giving us the opportunity to exhibit at […]

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