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  • 3D integration is our forte
  • Providing creative and innovative solutions is our promise
  • Customer satisfaction is our goal

Design SimulationPrototyping3D Device Integration Wafer-Level 3D System Integration

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3DiS Technologies

3DiS Technologies offers 3D integration and 3D packaging solutions based on its innovative 3D interconnection technologies. By leveraging the third dimension, the company’s cutting-edge technologies enable miniaturization of electronic systems and passive devices while improving their performance.

3DiS Enables

We use cutting edge 3D integration technologies to enable our customers to imagine, design and produce small form factor 3D electronic systems and products that matter.

3DiS Improves

We help our customers to improve the performance of their products by reducing interconnect length through direct 3D integration and to increase integration density through Wafer-Level 3D Packaging.

3DiS Adds Value

We add more value to our customer’s products through Wafer-Level 3D system integration and simultaneous integration of high-performance, small form factor, 3D integrated passive devices.

Creativity is thinking up new things. Innovation is doing new things.

- Theodore Levitt -

We are committed to providing creative and innovative solutions to our customers



We tackle electronic system integration problems with intelligence. We use cutting-edge technologies and cutting-edge thinking to bring the best solution to our customer’s problems.


We support our customers with each step of their product development : from concept, electrical and electromagnetic simulation & custom 3D IPD design, to process development, prototyping, characterization, small volume production & process transfer.



3DiS Technologies works with clients and partners around the world to address complex challenges of consumer, medical, defense & space electronic applications. Some of our clients & partners :

  • Centre National d’Etudes Spatiales

  • Thales Alenia Space


  • Bpifrance

  • Incubateur Midi-Pyrénées

  • Intraspec Technologies

  • 3DiS is member of Aerospace Valley

  • 3DiS is member of SEMI association

  • Université Toulouse 3 –
    Paul Sabatier


Thank you for your interest in 3DiS Technologies.
Get in touch with us by submitting a request here or to moc (tod) hcet-sid3 [ta] ofni. You can also have a glimpse of our latest news and upcoming events.

Contact Form

    • Our office address

      478 rue de la Découverte, CS 67624, 31676 Labège, France

    • Write us at

      moc (tod) hcet-sid3 [ta] ofni

    • our phone number

      0033 5 61 33 79 13

    • Our fabrication facility

      7 avenue du Colonel Roche – 31400 Toulouse, France