3DiS Technologies Dielectric-core-based HAR Thru-Package-Vias forming using 3D-RDL won the 3DInCites “Process of the Year” Award. The competition in this category was with Xperi, Plan Optik, CEA-Leti and YES. It is great to see 3DiS Technologies recognized for one of its innovative, 3D-RDL-based, advanced 3D Wafer-Level-Packaging technology solution. This technology enables innovation in advanced 3D packaging of next-generation 5G applications.

Background
Integrating all building blocks of an RF front-end for 5G applications in a small package and enabling optimal interfacing of the package with antenna array or integrating such antennas inside it (AiP) requires advanced 3D system packaging techniques. These include forming interconnects inside the package, multiple height thru-package-vias, and backside RDL. 3DiS Technologies developed a low-cost wafer-level process that allows the formation of multi-height, high aspect ratio TPVs (10:1) simultaneously with 3D-RDL that interconnects 3D stacked dies inside the package. Not only this solution is independent of a number of stacked dies and their thicknesses, but it also enables direct 3D integration inside the package cost-effectively. The technology was demonstrated on 3D-IPD devices and 3D RF SiP with stacked dies inside the package (in collaboration with Ampleon).

About 3DiS
3DiS Technologies provides access to its advanced 3D-WLP technologies & 3D-IPD to Startups and SMEs and offers fast prototyping as well as helping customers build new products and scale up very fast.

Read more about 3DInCites 2020 Awards by following this link

Share on: