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3DiS Technologies : winner of 3DInCites “Process of the Year” Award

· · · · · · · | News · Uncategorized

3DiS Technologies Dielectric-core-based HAR Thru-Package-Vias forming using 3D-RDL won the 3DInCites “Process of the Year” Award. The competition in this category was with Xperi, Plan Optik, CEA-Leti and YES. It is great to see 3DiS Technologies recognized for one of its innovative, 3D-RDL-based, advanced 3D Wafer-Level-Packaging technology solution. This technology enables innovation in advanced 3D […]

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3DiS is nominated for “Start-up of the Year” award by 3D InCites

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2017 3D InCites Awards Vote   3DiS Technologies is nominated for 3D InCites “Start-up of the Year” award. You are welcomed to connect to https://www.3dincites.com/3d-incites-awards/2017-3d-incites-awards-vote/  and vote for our start-up. You may vote one time in a 24 hour period.   The 3D InCites Awards were established in 2013 to acknowledge companies who were instrumental in bringing […]

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