3DiS Technologies : winner of 3DInCites “Process of the Year” Award

· · · · · · · | News · Uncategorized

3DiS Technologies Dielectric-core-based HAR Thru-Package-Vias forming using 3D-RDL won the 3DInCites “Process of the Year” Award. The competition in this category was with Xperi, Plan Optik, CEA-Leti and YES. It is great to see 3DiS Technologies recognized for one of its innovative, 3D-RDL-based, advanced 3D Wafer-Level-Packaging technology solution. This technology enables innovation in advanced 3D […]

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Ultra-thin QFN-like package was featured in Passive Components news

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Ultra-thin QFN-Like 3D Package with 3D Integrated Passive Devices paper presented at 69th ECTC 2019, in Las Vegas was featured in Passive Components News. The article effectively highlights the key advantages of the new package “This result showed the 3D integration capability of this concept, making it suitable for RF 3D wafer-level system-in-packages. The package […]

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