Electronic Components and Technology Conference (ECTC) 2019
3DiS Technologies presented “Ultra-thin QFN-Like 3D Package with 3D Integrated Passive Devices” paper at The 69th Electronic Components and Technology Conference (ECTC) 2019 that was held in Las Vegas. The work presented in this paper was the fruit of successful collaboration between 3DiS Technologies, NXP France, Besi Netherlands, Besi Austria and EV Group under the […]