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News & Upcoming Events

21
May

Electronic Components and Technology Conference (ECTC) 2018

· · · · | Events

3DiS Technologies will be presenting “Ultra-Compact, High-Performance, 3D-IPD Integrated using Conformal 3D Interconnects” paper at The Electronic Components and Technology Conference (ECTC) 2018. Kindly attend to our CEO’s Ayad GHANNAM presentation the 31st of May at 3:55 pm in Session 23: RF and THz Module Components.   The Electronic Components and Technology Conference (ECTC) is […]

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22
Jun

System-in-Package (SiP) Conference 2017

· · · · · | Events

3DiS Technologies will be presenting “Wafer-level 3D system packaging of IoT devices enabled by conformal 3D Interconnects” during startup pitch session. Kindly attend our presentation the 27th of June at 4:30 pm.   SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs – market trends, system integration/miniaturization, […]

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