We tackle electronic system integration problems with intelligence. We use cutting-edge technologies and cutting-edge thinking to bring the best solution to our customer’s problems.
We developped a complete solution that allows integration of high-performance, ultra-compact 3D IPD devices such as Filters, Couplers and Baluns. Plus, this technology enables integration of state-of-the-art 3D inductive devices such as Inductors, Transformers and 3D antennas.
Connecting semi-conductor devices to a laminate substrate or an interposer is enabled by high density peripheral 3D Interconnect technology. These interconnects improve electrical performance and integration density.
3D Redistribution Layer technology allows routing fine-pitch 3D copper traces on substrates having 3D topology. This technology is also used for substrate-less package integration or for integration above empty substrates.
We developed wafer-level 3D system packaging technology that allows native 3D integration of stacked dies using a single metallization step. A cost-effective technology that promises size reduction while improving system performance.