Events

11
Jan

European 3D Summit 2016

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3DiS Technologies is attending and presenting at European 3D TSV Summit, Grenoble from January 18 to 20. Ayad GHANNAM, CEO, invites you to kindly attend our Startup pitch: Jan/19 at 17H40.

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10
Sep

EMPC 2015 – 20th European Microelectronics and Packaging Conference & Exhibition

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3DiS Technologies is attending and presenting at EMPC 2015 from September 14 to 16. We invite you to kindly attend our talk: Sep/16 at 10:00 am – Session 8.1: Challenges in 2.5D and 3D Packages.  

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