System-in-Package (SiP) Conference 2017

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3DiS Technologies will be presenting “Wafer-level 3D system packaging of IoT devices enabled by conformal 3D Interconnects” during startup pitch session. Kindly attend our presentation the 27th of June at 4:30 pm.   SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs – market trends, system integration/miniaturization, […]

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SEMICON Europa 2016 – A success!

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3DiS Technologies team would like to thank all of you who visited our stand at Semicon Europa 2016 ! Thanks to you, our exhibition was a big success! We are looking forward to do a very successful business with you.   We also would like thank SEMI for giving us the opportunity to exhibit at […]

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SEMICON Europa 2016 – Innovation Village

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We are proud to announce that 3DiS Technologies has been selected to participate to SEMICON Europa INNOVATION Village. The INNOVATION Village at SEMICON Europa will showcase a selection of the most innovative start-ups as well as new innovative technologies ready for industrial transfer in an open platform setting.   Innovation Village will showcase both start-ups […]

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Semicon Europa 2016 – Exhibition

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3DiS Technologies will present and exhibit at SEMICON Europa 2016 which is held from Oct 25-27 in Alpexpo, Grenoble, France. Come meet us at our booth IV18 in Innovation Village! We are looking forward to exchanging with you.

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