Ayad Ghannam présentera 3DiS technologies courant la session “Pitch PME/Start-up” qui aura lieu le 12 juin de 14:00 à 14:30. Il aura le plaisir de vous rencontrer courant la journée du 12 juin pour discuter avec vous des dernières avancées technologiques de 3DiS Technologies en matière d’intégration de systèmes et de composants passifs 3D. […]
3DiS Technologies will be presenting “Ultra-Compact, High-Performance, 3D-IPD Integrated using Conformal 3D Interconnects” paper at The Electronic Components and Technology Conference (ECTC) 2018. Kindly attend to our CEO’s Ayad GHANNAM presentation the 31st of May at 3:55 pm in Session 23: RF and THz Module Components. The Electronic Components and Technology Conference (ECTC) is […]
3DiS Technologies will be presenting “Wafer-level 3D system packaging of IoT devices enabled by conformal 3D Interconnects” during startup pitch session. Kindly attend our presentation the 27th of June at 4:30 pm. SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs – market trends, system integration/miniaturization, […]
3DiS Technologies team would like to thank all of you who visited our stand at Semicon Europa 2016 ! Thanks to you, our exhibition was a big success! We are looking forward to do a very successful business with you. We also would like thank SEMI for giving us the opportunity to exhibit at […]