David is co-founder of 3DiS Technologies. He acts as a technical adviser where he brings its expertise in electrochimistry to help 3DiS with its technologies choice and development.
Engineer in electroplating, David have an extensive experience in electroplating and silicon wet etching gained during his work in LAAS-CNRS’s clean room. He is a specialist in thick photoresists and 3D copper electroplating. He assisted in the development of the 3D interconnect technology used by 3DiS Technologies.