Ayad GHANNAM, 3DiS Technologies CEO presented “3D-RDL and Conformal High Aspect Ratio Pre-formed TPVs for RDL-First Type FO-Packages: Enabler of Advanced 3D Wafer-level System Packaging for 5G Applications” at SEMI’s 3D & System Summit. Nowadays, RF communication modules are integrated in an increasing number of electronic devices. With the tight requirements of 5G applications, these […]
3DiS Technologies team would like to thank all of you who visited our stand at Semicon Europa 2016 ! Thanks to you, our exhibition was a big success! We are looking forward to do a very successful business with you. We also would like thank SEMI for giving us the opportunity to exhibit at […]
We are proud to announce that 3DiS Technologies has been selected to participate to SEMICON Europa INNOVATION Village. The INNOVATION Village at SEMICON Europa will showcase a selection of the most innovative start-ups as well as new innovative technologies ready for industrial transfer in an open platform setting. Innovation Village will showcase both start-ups […]
3DiS Technologies is attending and presenting at European 3D TSV Summit, Grenoble from January 18 to 20. Ayad GHANNAM, CEO, invites you to kindly attend our Startup pitch: Jan/19 at 17H40.